3D Mesh Generation
Mesh Type (Tapered and Manhattan)
TSolidX allows generating two types of 3D modeling structures: Tapered and Manhattan types.
Engineers can generate a tapered model as the real one using Tapered type which can set the taper angle or width.
In contrast, using the Manhattan type, a form of a right-angle structure, is a productive way to perform efficient analysis by minimizing the number of nodes.
Taper Model
Various taper models are provided to create a realistic 3D structure. By entering Taper Width or Taper Angle, a sidewall model is defined.
Etching Process Simulation
By using Unselective Etch and Until Zone functions, users can create a 3D structure as the actual etching process.
The etching process proceeds from the layer where Unselective Etch is applied to the layer just before the Etch Stopper.
In Until Zone, the etching process proceeds up to the layer designated as Until Zone. In this case, even if there is a layer specified as an etch stopper, the etch process is applied while ignoring it.
Colorize Image
Minimum and maximum positions can be checked easily based on the Reference layer and Target layer. As the colorized image is saved in a *.png format file, it is very efficient when checking the difference between layers.
CAx Format Files
The generation of 3D structures is very essential for performing computer-aided design and analysis. Based on the realistic semiconductor process, TSolidX generates accurate three-dimensional structures. Three types of 3D model data (Solid Model, 3D Triangular Mesh, 3D Tetrahedral Mesh)can be provided to utilize in various analysis fields.
-
Solid Model
- STEP AP214, AP203 (.stp)
- IGES 5.3 (.igs)
OLED Pixel
-
3D Triangular Mesh
- STL (.stl)
- Stanford Triangle (.ply)
- NASTRAN (.bdf)
- Alias/Wavefront (.obj)
- AutoCAD DXF (.dxf)
- Gmsh (.msh)
- Abaqus Input (.inp)
PCB Substrate
-
3D Tetrahedral Mesh
- NASTRAN (.bdf)
- ANSYS (.ans)
- Gmsh (.msh)
- Abaqus Input (.inp)
Heat Sink